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Chemical Intermediates
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General metal electroplating
1.1 Zinc Plating Chemicals
1.2 Copper Plating Chemicals
1.3 Nickel Plating Chemicals
1.4 Chrome Plating Chemicals
1.5 Alloy Plating Chemicals
1.6 Metal Pretreatment Chemicals
1.7 Post Treatment Chemicals
Electroless plating
Electronic plating
Aluminum Anodizing Chemicals
Chemical Intermediates
5.1 Zinc Plating Intermediates
5.2 Nickel Plating Intermediates
5.3 Copper Plating Intermediates
5.4 Zinc Nickel Alloy Intermediates
5.5 New Energy Intermediates
Surfactants
Coating Chemicals
Chemical Raw Materials
Surface treatment equipment
Chemical Intermediates
Fengfan CAS 89-98-5 OCBA O-Chlorobenzaldehyde Acid Zinc Electroplating Brightener
Fengfan CAS 122-57-6 Benzalacetone BAR ZINC PLATING INTERMEDIATE
Fengfan Alkylphenol Polyoxyethylene OS-8 ZINC PLATING INTERMEDIATE
Fengfan OX-608 CAS 26468-86-0 POLYETHYLENE GLYCOL MONO(2-ETHYLHEXYL)
Fengfan CAS 140-07-8 THEED ZINC NICKEL ALLOY PLATING INTERMEDIATE N,N,N',N'-Tetrakis(2-Hydroxyethyl)Ethylenediamine
Fengfan CAS 1965-29-3 2-(2-(2-Aminoethylamino)Ethylamino)Ethanol (NDE)
Fengfan CAS 2495-39-8 Sodium Allyl Sulphonate (ALS 35%) C3H5O3NaS
Fengfan CAS 20055-98-5 SSO3 Sodium2-hydroxy-3-mercaptopro-panesulphonate
Fengfan CAS 13580-38-6 Propargyl-Oxo-Propane-2,3-Dihydroxy POPDH
Fengfan CAS 30290-53-0 Progargyl-3-Sulfopropyl Na Salt POPS
Fengfan OX-501 Anionic Surfactant Intermediate Of Acid Zinc Plating Carrier For Acid Galvanizing
Fengfan OX-401 Acid Zinc Plating Intermediate Low Foam Anionic Surfactant For Acid Zinc Plating
Fengfan OX-301 Potassium Chloride Zinc Plating Intermediate Potassium Chloride Plating Carrier
Fengfan OX-201 Potassium Chloride Zinc Plating Intermediate High Temperaturer Carrier
Fengfan OX-105 Potassium Chloride Zinc Plating Intermediate High Temperature Zinc Plating Carrier
Fengfan CAS 42751-79-1 Dpe-III Poly (Dimethylamine-Co-Epichlorohydrin-Co-Ethylenediamine) Zinc Plating Intermediate
Fengfan CAS 68797-57-9 IZE Electroplating Intermediates For Alkaline Zinc Plating
Fengfan CAS 15990-43-9 Benzyl pyridinium 3-carboxylate BPC-48 C13H11NO2
Fengfan CAS 2495-39-8 Sodium Allyl Sulphonate (ALS 25%) C3H5O3NaS
Fengfan CAS 125678-52-6 Diethylamino propyne formic acid salt PABS
Fengfan CAS 84779-61-3 N N Diethyl-2-propyneammonium sulfate TC-DEP
Fengfan CAS 4079-68-9 Electroplating Intermediates 1-Diethylamino-2-Propyne DEP
Fengfan Cas 1606-79-7 Butynediol Propoxylate Nickel plating BMP
Fengfan CAS 102-60-3 EDTP N N N N Tetra 2 Hydropropyl Ethylene Diamine Zinc Nickel Alloy Plating
Fengfan CAS 49625-94-7 ZPS Sodium 3 Benzothiazol 2 Ylthio 1 Propanesulfonate Copper plating
Fengfan CAS 17636-10-1 MPS Sodium 3 Mercaptopropanesulphonate Copper Plating Chemicals
Fengfan CAS 17636-10-1 ST-001 Polyalkylene Glycol Monobutyl ether Copper plating
Fengfan CAS 27206-35-5 Bis-(Sodium Sulfopropyl)-Disulfide (SPS/SPS-95) C6H12Na2O6S4 Copper plating
Fengfan CAS 102-60-3 Plastic Electroplating Intermediates Raw Material For Pcb Chemical Q75
Fengfan CAS 3973-17-9 Propynol Propoxylate C6H10O2 PAP
Fengfan CAS 3973-18-0 Propynol Ethoxylate C5H8O2 PME
Fengfan CAS 3918-73-8 Pyridinium Hydroxyl Propyl Sulphobetaine PPSOH (solid) C8H11NO4S
Fengfan CAS 3918-73-8 1-(2-Hydroxy-3-Sulfopropyl)-Pyridinium Betain PPSOH 40% Additives For Nickel Electroplating
Fengfan CAS 15471-17-7 3-Pyridinium propylsulfonate-(1) Pyridinium propylsulfobetaine Nickel Plating Intermediates PPS
Fengfan CAS 1120-71-4 1 3-Propane Sultone (1 3-PS) C3H6O3S
Fengfan CAS 1633-83-6 1 4-Butane Sultone 1 4-BS C4H8O3S
Fengfan CAS 102-60-3 Q75 N N N' N'-Tetrakis 2-Hydroxypropyl Ethylenediamine For Electroless Copper Plating
Fengfan CAS 18880-36-9 DPS Copper electroplating additive N N-Dimethyl-dithiocarbumyl Propyl Sulfonate
Fengfan CAS 68555-36-2 Polyquaternium-2 Diaminoarea polymer WT
Fengfan CAS 1606-85-5 BEO 2-Butyne-1 Electroplating Intermediates 4-Diol Bis(2-Hydroxyethyl) Nickel Plating Intermediates
共 40 条
Fengfan
