• Fengfan CAS 17636-10-1 MPS Sodium 3 Mercaptopropanesulphonate Copper Plating Chemicals
  • Fengfan CAS 17636-10-1 MPS Sodium 3 Mercaptopropanesulphonate Copper Plating Chemicals

Fengfan CAS 17636-10-1 MPS Sodium 3 Mercaptopropanesulphonate Copper Plating Chemicals

White powder (CAS 17636-10-1) for acid copper brightener systems in PCB, decorative and functional copper plating.
  • Fengfan CAS 17636-10-1 MPS Sodium 3 Mercaptopropanesulphonate Copper Plating Chemicals

Description

Product Overview

MPS in one line

MPS is the trade name for sodium 3-mercaptopropanesulphonate, an organic sulphur salt used as the brightener component of acid copper systems. We supply it as a white powder at 95% assay for printed circuit boards, for decorative copper, and for functional copper where the plating process is judged on what the layer has to survive rather than on how it looks on the rack.

What the molecule does

The sodium sulphonate end carries the salt into water; the mercapto sulphur is the part that reaches the cathode and refines the copper grain as it grows. Brightness and ductility come out of that same action, which is why they tend to move together — a fine, even grain reflects light cleanly and still bends without cracking. In electronic plating shops the same behaviour is what keeps a plated through-hole continuous instead of nodular.

Specifications

Chemical nameSodium 3-mercaptopropanesulphonate
Trade nameMPS
CAS No.17636-10-1
EINECS No.241-620-3
Molecular formulaC3H7NaO3S2
Molecular weight178.2
Melting point~220 °C (dec.)(lit.)
Assay95%
AppearanceWhite powder
Chemical familyOrganic sulphur salt
Functional groupsMercapto (thiol) and sodium sulphonate
Ionic characterAnionic
SolubilityWater-soluble

Performance in Acid Copper Baths

  • Brightness across the work — as a brightener for acid copper plating, MPS lifts the lustre of the deposit over the whole visible surface, which is what earns it a place in both decorative and functional copper baths.
  • Ductility that keeps up — paired with a polyether and a non-ionic surface active agent, it improves brightness and ductility together, so the layer forms and bends without the cracking that follows a bright-but-brittle deposit.
  • Finer grain — the sulphur works at the cathode where copper nucleates, so the grains come in denser; the practical result at the same thickness is a smoother, more uniform layer rather than a coarse matte one.
  • A component, not a cure-all — the brightener level is only one variable in a metal plating process; if the deposit is dull at the edges or burnt at the high-current end, current density and agitation usually come before another gram of MPS.
  • Made for current-driven baths — this grade is intended for acid copper lines where the deposit is driven by rectifier current; an electroless copper plating bath runs on a different mechanism and the powder should not be dropped into one on assumption.
  • Weighed in grams, not litres — MPS is a minor constituent of a brightener package, so accuracy at the balance matters more than volume; a small scoop error is a large error in the tank.

Co-Addition & Formulation

With a polyether and a non-ionic surfactant

Run MPS alongside a polyether and a non-ionic surface active agent and the pair does more than either alone: the polyether moderates how copper reaches the surface while the sulphur compound sets the grain, so brightness and ductility improve at the same time. This is the combination most acid copper packages are built on, and it is the first thing to get right before trimming anything else.

With a polyamine, a dye or another sulphur compound

Adding a polyamine, a dye or a further sulphur compound to the same package pushes the response further — the effect is noted to improve rather than to plateau. In practice MPS is almost never used alone: it is one member of a multi-component system, and its level is set against the other members rather than in isolation.

Matching a package you already run

Tell us the bath type — sulphate or mixed acid copper — the substrate, and the other plating chemicals already in your brightener, and we will say whether this 95% powder is the right grade for that make-up. Formulators building something new usually start from the same three questions: what brightness does the part need, how much ductility can be traded for it, and what does the rest of the package already contain.

Application Areas

  • Printed circuit boards — the acid copper layer that follows the electroless copper plating seed in a plated through-hole; this is the application MPS is most often specified for, because the deposit has to stay continuous through the barrel.
  • Decorative copper — hardware, sanitaryware and lighting parts copper plated before nickel or chrome; the brightness the sulphur component contributes is still visible under the top coats.
  • Functional copper — engineering parts where the copper carries current, takes solder or spreads heat; in the process of electroplating these parts, ductility counts for more than gloss, and that is exactly what the polyether and sulphur pairing protects.
  • Electronics manufacturing — electronic plating lines in board shops, where the copper is followed by resist, etch and inspection steps and any nodule or void becomes a scrap part.
  • Brightener formulators — additive makers who build their own concentrates and would rather buy one defined molecule with a stated assay than a blended liquid with an unknown composition.

Packing, Handling & Storage

In the plant

Treat MPS as a fine powder rather than a liquid. Weigh it in a dry, draught-free area, wear a dust mask and eye protection, and keep the scoop and balance clear of acid or oxidiser residues from the next drum along — in a metal plating process, a scoop that has been in the wrong container is a contamination event, not a rounding error. Most lines dissolve the weighed powder in a small volume of demineralised water with stirring before it joins the make-up, which stops undissolved particles from settling on the work.

In the store

Keep the container closed and the store dry. Moisture is the practical enemy of a sulphonate powder: it takes up water, cakes, and then weighs heavy, so a scoop from a damp drum is not the same dose as a scoop from a dry one. Store away from acids, oxidisers and direct sunlight, and rotate stock so the oldest lot goes first.

Before it ships

The safety data sheet for the current lot is available from your sales contact, together with the transport information a freight forwarder will ask for. Classification and labelling differ between markets, so check the rules that apply where you operate before the consignment leaves.

On the line

Label the brightener container clearly and keep it apart from the wetter. In a busy plating process, mis-pouring two pale powders is a common and expensive mistake, and it usually shows up as a batch of parts that will not pass inspection.

Related Products

  • FI-970 Bright Acid Copper Plating Process — the complete acid copper system for shops that would rather buy a finished process than build one from plating chemicals.
  • SZ-30B Sulfate Zinc Plating brightener — sulphate zinc for wire, strip and continuous lines.
  • ZN 50 Bright Zinc Alkaline — alkaline zinc for rack and barrel work.
  • ZN-500 brightener for cyanide-free alkaline zinc — the cyanide-free route for shops moving off cyanide baths.
  • Phoenix EB 204A-204B divalent tin salt electrolytic colouring additive — colouring for anodised aluminium.
  • Phoenix Seal 149-L middle temperature sealing agent — sealing for anodised aluminium after colouring.
  • Phoenix Seal 149-T medium temperature sealing agent — the medium-temperature alternative for the same step.
  • Nickel Purify P3 — bath purification for nickel lines that have started to drift.
  • FF-116 chrome mist inhibitor — cuts chromic mist at the chrome tank, one of the less pleasant steps in a metal plating process.
  • FF-4219 nano-protective for wood, stone and concrete — the same surface-treatment thinking applied outside the plating shop.

Assay, Appearance & Batch Consistency

Reading the assay

95% is the figure to build dosing on. It is not a purity claim in the absolute sense — it tells you how much of the weighed powder is the active sodium salt, so a formulation written for 95% material stays reproducible through a plating process that runs for months, provided every lot is checked against the same number.

Checking identity

Three values do most of the work when a delivery is queried: CAS 17636-10-1 confirms the molecule, EINECS 241-620-3 is the inventory reference, and a molecular weight of 178.2 matches the formula C3H7NaO3S2. A product sold under the same three trade letters from a different CAS is a different brightener and will not behave the same in a tuned bath.

What the powder looks like

White, with a fine granular texture. In the container it can settle into soft clumps; those break up under a spatula and are not a sign of degradation, but a lot that has taken up enough water to feel damp should be queried before it goes into a make-up.

Lot to lot

In the process of electroplating copper, the additive is usually the first thing to move when a deposit starts to drift. Holding the same grade and the same assay from lot to lot takes one variable off the troubleshooting list, and it is the reason we treat the assay as a specification rather than as a typical value.

Ordering & Delivery

  • Order quantity — varies by chemical and is confirmed with our sales team for each order, so tell us the volume you expect to run through and we will quote against it.
  • Payment — 100% T/T in advance.
  • Lead time — 2 weeks.
  • Packing — 10 kg/box; 25 kg or 50 kg/bag; 20 kg/25 kg/30 kg/200 kg/drum; 1000 kg/IBC drum. Tell us which format suits your store and the order will be packed to it.
  • Shipping — per the terms agreed in the current contract.
  • Documents — an inspection certificate is issued after delivery stating the batch number and warranty period.
  • Samples — ask your sales contact about sample availability for the grade you are considering.
  • Technical questions — send the bath type, the substrate and the brightener package you already run, and the reply will be specific to your own line.

Technical Support & Model Matching

Choosing the right match is where most sourcing decisions stall. As a trading supplier, we keep one point of contact from first enquiry to after-sales: tell us what you are making and the conditions you work under, and we shortlist the closest matches from our supplier network, compare specifications and arrange samples before you commit to a bulk order. If something does not behave as expected, we work with the supplying partner on the cause and a practical fix, and stay with the case until it is settled. Email, WeChat or WhatsApp enquiries get a reply within 24 hours.

FAQ

Is MPS the same as SPS or ZPS?

No. They are different molecules that happen to be sold under similar three-letter names in acid copper work, and those letters are not standardised between suppliers. MPS is sodium 3-mercaptopropanesulphonate, CAS 17636-10-1 — a single sulphur compound, not a disulphide and not a benzothiazole derivative. When you are matching a formulation, order by CAS number and assay: in the process of electroplating copper, swapping a supplier on a trade name alone is how a stable bath suddenly starts drifting.

Can it be used in an electroless copper plating line?

The grade we supply is built for acid copper baths driven by rectifier current. Electroless copper plating deposits chemically and runs a different additive package, so the powder should not be substituted into one on the assumption that it behaves the same. Send us the bath type and the operating conditions and we will say whether MPS is the right component for your case.

Is this a raw material or a ready-to-use additive?

A raw material — one component of a brightener package. Buying plating chemicals at this level means you dissolve the powder and build your own concentrate, or add it to an existing one under your own formulation. If you want a single product that fixes a dull copper bath, a complete acid copper process is the better purchase than an intermediate.

Does MPS replace the wetter or the leveller in my bath?

No. MPS works as the brightener component and is dosed as a minor part of the package. Wetting and surface-tension control come from the non-ionic surface active agent, and levelling from the polyether or polyamine side of the formulation. Taking one of those out to make room for more MPS usually gives a brighter but more brittle deposit, which is the opposite of what the combination is for.

Will it work for decorative copper as well as PCB work?

Yes. The chemistry is the same; what changes is what the deposit has to survive. On a decorative part the copper is judged on colour and brightness under nickel or chrome. On a board it is judged on continuity through the hole and on how the layer behaves in the etch and resist steps that follow, which is why electronic plating lines build their brightener package around a sulphur component rather than around a wetter alone.

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