Fengfan Cyanide-free electroplated pure gold FI-7876

Product Overview

This is a cyanide-free gold electroplating process that deposits a pure gold layer on transistors, integrated circuits, chip carriers and other semiconductor components. Parts leave the bath with a gold surface, good ductility and clean solderability, and a contact resistance that holds through storage. The deposit also resists corrosion and keeps its colour, so a batch plated this month still looks right when it reaches assembly next month.

The bath itself is stable and plates quickly, which is what makes a production cycle predictable — the same make-up, the same result, without a long dwell in the tank to reach thickness. It runs on rack (hanging) lines and in barrels, so loose pins and springs and racked work can share one chemistry. And because the formulation contains no cyanide, gold plating companies no longer carry the handling and waste burden of a cyanide bath.

Performance Advantages

• Pure gold in the finished layer. The coating is pure gold rather than a gold alloy, so the surface behaves like gold: low, stable resistance with nothing diluted by alloying elements.
• Low contact resistance. The deposit holds a low, stable resistance, and it is what stops a fine-pitch IC or chip-carrier contact from adding resistance exactly where the signal can least afford it.
• Solder joints form cleanly. Good solderability means parts can move from the plating rack into assembly without a preparation step in between.
• Ductile, not brittle. The layer bends with the substrate, so a contact that is formed or crimped after plating does not crack along the bend.
• Corrosion resistance and long colour retention. The gold resists tarnish in storage and in service, which is why parts can be plated in one batch and assembled much later.
• No cyanide in the formulation. Taking cyanide out of a metal plating process removes the acute hazard from the gold step — no cyanide salts to store, handle or account for in the waste stream.
• Stable plating solution, fast deposition. The bath holds its balance in production and plates quickly, so cycles stay short and results repeat from lot to lot — the consistency gold plating services schedule around.
• Rack or barrel from the same chemistry. One bath covers racked parts and loose small parts, which keeps gold plating simple for a shop handling mixed work.

Deposit Properties and Coating Data

Where the Process Is Used

• Semiconductor components. Transistors, integrated circuits and chip carriers are the parts this process is specified for, and the gold normally goes on as the last step before assembly.
• Loose pins, springs and terminals. Small parts that arrive in bulk — stamped pins, coil springs, cylindrical terminals — run through a barrel as one load.
• Prototype and qualification work. A rack line lets a shop plate a handful of parts to prove out the process of electroplating on a new component before committing a barrel load.
• Job shops running gold plating services. A plater serving several electronics customers can hold one bath for both racked and barrelled work instead of qualifying two chemistries.
• In-house lines leaving cyanide behind. Where a metal plating process has to come off cyanide, the change stays inside the gold step and the rest of the cycle is untouched.
• Shops quoting to a customer drawing. When a specification calls for 99.99% gold and a contact-resistance limit, those are the numbers this process is set up to meet — which is what gold plating companies need before they can quote.

Line Sequence and Integration

1. Clean and degrease. The first step in any metal plating process is a surface free of oil, wax and handling residue; anything left behind turns into a skip or a dull patch later.
2. Rinse and activate. Rinse the cleaning chemistry off, then activate the surface so the gold bonds the moment the part enters the bath.
3. Gold plating. The process of electroplating gold here decides the result, and it is where gold plating companies focus their process control: the part stays in the bath until the deposit reaches the thickness your drawing calls for, and we confirm the dwell time and current density for your geometry before the tank is charged.
4. Drag-out recovery. Pull the work slowly and rinse over a recovery tank so gold returns to the plating solution instead of leaving on the part.
5. Rinse. A clean rinse after the gold step, with the water changed often enough that it does not carry gold out of the line.
6. Dry and inspect. Dry without water marks and check appearance and thickness against the specification before the batch moves on — the final check gold plating services run before a lot is released.

Ordering, Packing and Delivery

Related Processes in the Range

• The gold step inside a wider line. Gold plating is one stage of a finishing sequence, and the same range covers the cleaning, zinc, copper, nickel and tin processes around it, so a line can be equipped from one place.
• Fengfan Brightener for SZ-30B Sulfate Zinc Plating — brightener for sulfate zinc baths, used on continuous wire lines as well as single workpieces.
• Fengfan Bright Zinc Alkaline for Rack and Barrel Plating ZN 50 and Fengfan Brightener for Cyanide Free Alkaline Zinc Plating ZN-500 — alkaline non-cyanide zinc systems for rack and barrel work, with ZN-500 holding a wide operating temperature window.
• Fengfan High Deposit Brightness Copper Plating FI-970 Bright Acid Copper Plating Process — bright acid copper with strong levelling and ductility kept intact for later polishing.
• Fengfan Nickel Purify P3 — a bright nickel bath treatment that removes copper, zinc, iron and chromium impurities without stopping production, useful wherever a nickel layer sits under the gold.
• Fengfan Phoenix EB 204A-204B Divalent Tin Salt Electrolytic Coloring Additive, Fengfan Phoenix Seal 149-L Middle Temperature Sealing Agent for Aluminum Anodizing and Fengfan Phoenix Seal 149-T Medium Temperature Sealing Agent — colouring and sealing for anodised aluminium, from electrolytic colour through to medium-temperature sealing.
• Fengfan Wood Stone Concrete Nano-Protective FF-4219 — water-based nano protection for wood, stone and concrete surfaces.
• Fengfan Environmentally Friendly Chrome Mist Inhibitor FF-116 — mist suppression for chromium plating baths at low dosage.
• Continuity across the gold electroplating step. Because the cleaning, the nickel beneath the gold and the gold bath itself come from one supplier, a defect at the gold stage is not passed between three companies.

Technical Support & Model Matching

Choosing the right match is where most sourcing decisions stall. As a trading supplier, we keep one point of contact from first enquiry to after-sales: tell us what you are making and the conditions you work under, and we shortlist the closest matches from our supplier network, compare specifications and arrange samples before you commit to a bulk order. If something does not behave as expected, we work with the supplying partner on the cause and a practical fix, and stay with the case until it is settled. Email, WeChat or WhatsApp enquiries get a reply within 24 hours.

FAQ