• Fengfan CAS 102-60-3 Q75  N N N' N'-Tetrakis 2-Hydroxypropyl Ethylenediamine For Electroless Copper Plating
  • Fengfan CAS 102-60-3 Q75  N N N' N'-Tetrakis 2-Hydroxypropyl Ethylenediamine For Electroless Copper Plating

Fengfan CAS 102-60-3 Q75 N N N' N'-Tetrakis 2-Hydroxypropyl Ethylenediamine For Electroless Copper Plating

Chemical name:  N,N,N',N'-Tetrakis 2-Hydroxypropyl Ethylenediamine ; Hexamethylene tramine tra hydroxy propy chloride; Q75

CAS No.:  102-60-3

Molecular formula:  C14H32N2O4

Molecular weight:  294.42


  • Fengfan CAS 102-60-3 Q75  N N N' N'-Tetrakis 2-Hydroxypropyl Ethylenediamine For Electroless Copper Plating

Description

Properties

Physical form Colorless to light yellow clear liquid
Concentration (%) 74.5-75.5
PH 8.0-12.0
Solubility(20°C) Miscible with water in all proportions

 

Application:

Q75 is used as metal complexing agent, used as scaling powder and cleaner in electroless copper PCB plating.

 

Packing:

25kg/drum, stored in cool and dry place

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