• Fengfan Barrel Plating Bright Acid Copper Process Electroplating Additive FFI-22
  • Fengfan Barrel Plating Bright Acid Copper Process Electroplating Additive FFI-22

Fengfan Barrel Plating Bright Acid Copper Process Electroplating Additive FFI-22

  • High Light

    Barrel Plating Electroplating Additive

    , 

    FFI-22 Electroplating Additive

    , 

    Bright Acid Copper Process

  • Color
    Blue Liquid
  • Type
    Copper Plating Additive
  • Characteristic
    Barrel Plating Acid Copper Plating
  • Place of Origin
    CHINA
  • Brand Name
    FENGFAN
  • Model Number
    FFI-22
  • Fengfan Barrel Plating Bright Acid Copper Process Electroplating Additive FFI-22

Description

Barrel bright acid copper process FFI-22

 

INTRODUCTION
FFI-22 is a bright acid copper process formulated to produce a fine-grained, excellent coverness,
uniform, bright copper deposit. The process exhibits best capability of uniform plating. It is for
barrel plating.


BENEFITS
The capability of uniformplating is excellent, even plating through hole;
The deposit exhibits brightness and the excellent capability of uniform plating;
The deposit has no stress, and is suitable for thermal cycle test;
No need to treat the plating solution with active carbon for long time.


STANDARD BATH COMPOSITION

 

  Unit Range Optimum
CuSO4•5H2O g/L 60 - 100 80
H2SO4 %(v/v) 9 - 12 10
Clˉ mg/L 30 - 80 50
FFI-22 R mL/L 4 - 6 5
FFI-22 Mu mL/L 3 - 6 5

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