This immersion gold bath lays a 24-carat gold layer onto nickel and nickel alloys by chemical displacement: gold ions in the solution swap places with nickel atoms at the surface, and the reaction stops on its own once that surface is covered. In a PCB shop the nickel gold plating step is the last wet stage before test and pack, and it is what gives each pad its flat, oxidation-resistant, readily solderable finish. The same bath finishes decorative work too — a hardware fitting, a jewellery component or a connector shell that already carries a nickel layer.
Because the deposit grows by displacement rather than by current, it reaches every isolated pad, pin and recess on the rack without bus bars or contacts. That is what makes it a practical metal plating process for high-density boards and for parts with deep internal geometry: coverage depends on the solution reaching the surface, not on where current can flow.
Working deposits are a fraction of a micron thick, and the reaction stops by itself once the nickel is covered — leaving parts in longer will not grow a heavy gold layer. That ceiling is deliberate. It keeps gold consumption predictable for a gold plating business running several customers on one line, and it is what protects the solder joint from gold embrittlement.
| Parameter | Value |
|---|---|
| Gold concentration (Au) | 0.5–2.5 g/L |
| FF-7885 additive | 50–125 ml/L |
| pH | 4.0–5.0 |
| Temperature | 80–90 °C |
| Immersion time | 10–15 min |
| Substrate | Nickel and nickel alloys |
| Underlayer | Mid- or high-phosphorus electroless nickel |
| Deposit colour | 24-carat gold |
| Plating thickness (typical) | 0.03–0.1 µm |
| Maximum deposit thickness | 0.2 µm |
| Deposit mechanism | Immersion (displacement), self-limiting |
Decorative hardware and connector shells
A finishing shop running gold plating brass fittings for telecommunications racks starts with an electroless nickel layer on the brass, then transfers the parts into the gold tank. The brass never meets the gold solution directly — the nickel is what the gold displaces — so the quality of the nickel layer decides the final result.
Automotive sensor boards
A process engineer finishing multi-layer boards for under-bonnet sensors uses this tank as the final finish after the electroless nickel plating step. The flat pad surface matters more than the colour here: fine-pitch components need a pad that sits level with the solder mask and wets instantly in reflow.
A shop running nickel gold plating for several customers
A job plater taking boards from more than one customer runs a single bath of plating chemicals and books the dwell against each customer's specified thickness. Because the reaction is self-limiting, a rack left in a few minutes longer does not come out visibly over-plated.
Incoming inspection
A quality technician cross-sections a finished board to confirm that the gold sits on the nickel as a continuous, non-porous layer with no nickel corrosion underneath. A clean cross-section and a good wetting balance result are what release the batch to assembly.


| Term | Detail |
| Payment | 100% T/T in advance |
| Minimum order quantity | Varies by chemical; confirmed with our sales team per order |
| Lead time | 2 weeks |
| Packing | 10 kg/box; 25 kg or 50 kg/bag; 20 kg/25 kg/30 kg/200 kg/drum; 1,000 kg/IBC drum |
| Shipping | Per the terms agreed in the current contract |
| Bulk delivery | Industrial quantities; confirm the drum or IBC size that matches your consumption with our sales team |
| Packaging integrity | Sealed, labelled packs keep the additive free from contamination in transit |
| Documentation | Inspection certificate issued after delivery, stating the batch number and warranty period |
Choosing the right match is where most sourcing decisions stall. As a trading supplier, we keep one point of contact from first enquiry to after-sales: tell us what you are making and the conditions you work under, and we shortlist the closest matches from our supplier network, compare specifications and arrange samples before you commit to a bulk order. If something does not behave as expected, we work with the supplying partner on the cause and a practical fix, and stay with the case until it is settled. Email, WeChat or WhatsApp enquiries get a reply within 24 hours.
Nickel and nickel alloys — the gold deposits by displacement on a nickel surface, so the part must already carry one. On a PCB that means the mid- or high-phosphorus nickel layer from the preceding sequence; on decorative work it means an electroless nickel layer over brass, zinc die-casting or steel. Bare copper, bare brass and bare aluminium will not take the deposit, which is what makes this a nickel gold plating finish rather than a stand-alone gold plate.
The reaction is self-limiting. Gold ions displace nickel atoms until the nickel is covered, and then the reaction has nothing left to work on, so plating thickness is governed by the chemistry and by how completely the surface is wetted rather than by how long the rack stays in. That is also why gold embrittlement at the solder joint is not a factor here. If a drawing calls for a substantially heavier gold layer, that is a different process rather than a longer dip, and we will tell you so before you order.
Yes, within defined ranges. The chemical gilding bath can be run at different points inside its working windows to suit a line's throughput, tank size and the thickness a customer specifies, and it stays stable across that range. Send us the parameters you intend to run and we will confirm the settings before you charge the tank, because moving two of them at once is the usual cause of a colour that will not repeat.
Both are tolerated far better here than in a conventional gold bath, and both will build up — every rack coming out of the nickel tank drags solution with it. Because the chemistry keeps working in their presence, the bath holds its deposition rate through a long production run instead of drifting, and make-ups are less frequent. If the colour goes flat or the rate drops, send us an analysis: it usually points at drag-in from upstream plating chemicals or at a pH that has moved rather than at the gold content.
Yes. There is no current path in this metal plating process — gold arrives at the surface by chemical displacement, so every isolated pad, pin and recessed contact on the rack is treated the same way. That is the practical reason high-density boards and connectors with internal geometry use an immersion finish instead of an electrolytic one, which would need a bus bar to every feature and a rack design to match.
Yes, provided they carry a nickel layer. For gold plating brass shells, findings, buckles or similar decorative parts, the sequence is electroless nickel first and gold second; the brass itself should never be the surface the gold sees, or adhesion and colour both suffer. Thin-walled or sharply recessed parts need a nickel layer thick enough to stay continuous into the recess, so check nickel coverage before the decorative run rather than after it.
The gold layer is there to protect the electroless nickel plating underneath from oxidation, and it keeps doing that through normal storage and handling. Keep boards in their sealed packaging until assembly, avoid bare-hand contact on the pads, wash and dry them if they have been exposed to a humid shop floor, and run your usual bake and reflow profile. The finish is flat and oxidation-resistant, so solder wets quickly and wire bonding sees a clean surface with low contact resistance. If a batch has sat in a damp area for a long time, solder a sample before committing the whole lot.