• Fengfan FI-7885 Chemical Gilding PCB chemical nickel gold and decorative immersion gold
  • Fengfan FI-7885 Chemical Gilding PCB chemical nickel gold and decorative immersion gold

Fengfan FI-7885 Chemical Gilding PCB chemical nickel gold and decorative immersion gold

Cyanide-free chemical gilding deposits a dense 24-carat gold layer on nickel and its alloys for PCB finish, wire bonding and decorative hardware.
  • Fengfan FI-7885 Chemical Gilding PCB chemical nickel gold and decorative immersion gold

Description

Product Overview

This immersion gold bath lays a 24-carat gold layer onto nickel and nickel alloys by chemical displacement: gold ions in the solution swap places with nickel atoms at the surface, and the reaction stops on its own once that surface is covered. In a PCB shop the nickel gold plating step is the last wet stage before test and pack, and it is what gives each pad its flat, oxidation-resistant, readily solderable finish. The same bath finishes decorative work too — a hardware fitting, a jewellery component or a connector shell that already carries a nickel layer.

Because the deposit grows by displacement rather than by current, it reaches every isolated pad, pin and recess on the rack without bus bars or contacts. That is what makes it a practical metal plating process for high-density boards and for parts with deep internal geometry: coverage depends on the solution reaching the surface, not on where current can flow.

Working deposits are a fraction of a micron thick, and the reaction stops by itself once the nickel is covered — leaving parts in longer will not grow a heavy gold layer. That ceiling is deliberate. It keeps gold consumption predictable for a gold plating business running several customers on one line, and it is what protects the solder joint from gold embrittlement.

Process Specifications

ParameterValue
Gold concentration (Au)0.5–2.5 g/L
FF-7885 additive50–125 ml/L
pH4.0–5.0
Temperature80–90 °C
Immersion time10–15 min
SubstrateNickel and nickel alloys
UnderlayerMid- or high-phosphorus electroless nickel
Deposit colour24-carat gold
Plating thickness (typical)0.03–0.1 µm
Maximum deposit thickness0.2 µm
Deposit mechanismImmersion (displacement), self-limiting

Performance Advantages

  • Cyanide-free chemistry. The bath dissolves its gold with an organic ligand system instead of cyanide, so the line avoids cyanide handling and the effluent side has no cyanide destruction stage to run.
  • Self-limiting plating thickness. The displacement reaction slows and stops as the nickel is covered, so the layer cannot run away on a long dwell and the pad stays flat.
  • A dense, non-porous barrier. Porosity is what lets the nickel underneath corrode and what turns into black pad failures later; a continuous gold layer closes that route.
  • A wide gold window. You can run at the lower end of the gold concentration range without losing deposition speed, which lowers the metal a gold plating business ties up in the tank.
  • Built around the electroless nickel plating step. The chemistry is designed to sit on mid- or high-phosphorus nickel without attacking the barrier layer, which is what keeps colour and solderability stable.
  • Even colour on awkward geometry. Recessed and isolated areas take the same 24-carat tone as the flat faces because the reaction is chemical rather than field-driven.

Bath Make-Up & Control

  1. Load the rack so solution can reach every face. Parts that touch each other shield the nickel from the gold and leave contact marks that no amount of extra dwell will plate over.
  2. Dissolve the gold salt completely before anything else. Add it to hot deionised water and stir until the solution is clear; undissolved salt settles on the bottom and produces local over-plating and colour streaks.
  3. Add the additive and set the pH before the first rack goes in. Measure pH again after every top-up, because it drifts as work passes through the tank.
  4. Hold the working temperature steady. A bath that cools mid-shift deposits more slowly and gives a thinner, redder layer, so watch the heaters and the level through the day.
  5. Analyse and replenish in ratio. Titrate the gold content on a fixed schedule and top up the gold salt together with the plating chemicals so the two stay in balance rather than chasing each other.
  6. Keep a slow filter loop running and watch the level. A hot metal plating process loses volume to evaporation all shift; replace it with deionised water, not with raw water that brings hardness and chloride into the bath.
  7. Book the dwell against the customer specification. Time in the tank is what the required thickness is recorded against, so log it per rack instead of running the line on feel.

Use Scenarios

Decorative hardware and connector shells

A finishing shop running gold plating brass fittings for telecommunications racks starts with an electroless nickel layer on the brass, then transfers the parts into the gold tank. The brass never meets the gold solution directly — the nickel is what the gold displaces — so the quality of the nickel layer decides the final result.

Automotive sensor boards

A process engineer finishing multi-layer boards for under-bonnet sensors uses this tank as the final finish after the electroless nickel plating step. The flat pad surface matters more than the colour here: fine-pitch components need a pad that sits level with the solder mask and wets instantly in reflow.

A shop running nickel gold plating for several customers

A job plater taking boards from more than one customer runs a single bath of plating chemicals and books the dwell against each customer's specified thickness. Because the reaction is self-limiting, a rack left in a few minutes longer does not come out visibly over-plated.

Incoming inspection

A quality technician cross-sections a finished board to confirm that the gold sits on the nickel as a continuous, non-porous layer with no nickel corrosion underneath. A clean cross-section and a good wetting balance result are what release the batch to assembly.

Decorative Gold Finishing

  1. Confirm the finish on a sample first. Chemical gilding gives a 24-carat yellow tone over nickel; check it against the customer's approved sample before the run, since tone shifts with the nickel phosphorus level and with dwell time.
  2. Build the nickel underlayer before anything else. Decorative parts need a sound mid- or high-phosphorus nickel layer; a thin or porous layer shows through the gold as patches and dull spots.
  3. Rinse and transfer wet. Dry nickel passivates in air within minutes, so keep the parts under water between the nickel tank and the gold tank.
  4. Rack for drainage rather than packing parts tightly. Watch the recesses when your gold plating business works with brass shells and jewellery findings: that is where the nickel layer thins out, and the gold will faithfully follow that weakness.
  5. Rinse, dry and inspect under proper light. Check colour against the approved sample and look at the recesses and edges rather than the flat faces, where defects hide.
  6. Decide on a topcoat if the part will be handled. A decorative gold layer is thin by nature; if the item will be touched, packed loose or worn against skin and clothing, ask our team about a protective topcoat before you commit the specification.
Gold-tone jewelry charms and findings assortmentFengfan FI-7885 Chemical Gilding PCB chemical nickel gold and decorative immersion gold

Ordering & Delivery

TermDetail
Payment100% T/T in advance
Minimum order quantityVaries by chemical; confirmed with our sales team per order
Lead time2 weeks
Packing10 kg/box; 25 kg or 50 kg/bag; 20 kg/25 kg/30 kg/200 kg/drum; 1,000 kg/IBC drum
ShippingPer the terms agreed in the current contract
Bulk deliveryIndustrial quantities; confirm the drum or IBC size that matches your consumption with our sales team
Packaging integritySealed, labelled packs keep the additive free from contamination in transit
DocumentationInspection certificate issued after delivery, stating the batch number and warranty period

Technical Support & Model Matching

Choosing the right match is where most sourcing decisions stall. As a trading supplier, we keep one point of contact from first enquiry to after-sales: tell us what you are making and the conditions you work under, and we shortlist the closest matches from our supplier network, compare specifications and arrange samples before you commit to a bulk order. If something does not behave as expected, we work with the supplying partner on the cause and a practical fix, and stay with the case until it is settled. Email, WeChat or WhatsApp enquiries get a reply within 24 hours.

FAQ

Which substrates can this process be used on?

Nickel and nickel alloys — the gold deposits by displacement on a nickel surface, so the part must already carry one. On a PCB that means the mid- or high-phosphorus nickel layer from the preceding sequence; on decorative work it means an electroless nickel layer over brass, zinc die-casting or steel. Bare copper, bare brass and bare aluminium will not take the deposit, which is what makes this a nickel gold plating finish rather than a stand-alone gold plate.

How is plating thickness controlled, and why does the layer stop growing?

The reaction is self-limiting. Gold ions displace nickel atoms until the nickel is covered, and then the reaction has nothing left to work on, so plating thickness is governed by the chemistry and by how completely the surface is wetted rather than by how long the rack stays in. That is also why gold embrittlement at the solder joint is not a factor here. If a drawing calls for a substantially heavier gold layer, that is a different process rather than a longer dip, and we will tell you so before you order.

Can the bath be adjusted for a different line or a different board design?

Yes, within defined ranges. The chemical gilding bath can be run at different points inside its working windows to suit a line's throughput, tank size and the thickness a customer specifies, and it stays stable across that range. Send us the parameters you intend to run and we will confirm the settings before you charge the tank, because moving two of them at once is the usual cause of a colour that will not repeat.

What happens when copper or nickel builds up in the bath?

Both are tolerated far better here than in a conventional gold bath, and both will build up — every rack coming out of the nickel tank drags solution with it. Because the chemistry keeps working in their presence, the bath holds its deposition rate through a long production run instead of drifting, and make-ups are less frequent. If the colour goes flat or the rate drops, send us an analysis: it usually points at drag-in from upstream plating chemicals or at a pH that has moved rather than at the gold content.

Will isolated pads and fine-pitch features plate without electrical contact?

Yes. There is no current path in this metal plating process — gold arrives at the surface by chemical displacement, so every isolated pad, pin and recessed contact on the rack is treated the same way. That is the practical reason high-density boards and connectors with internal geometry use an immersion finish instead of an electrolytic one, which would need a bus bar to every feature and a rack design to match.

Can brass fittings or jewellery components be finished with this process?

Yes, provided they carry a nickel layer. For gold plating brass shells, findings, buckles or similar decorative parts, the sequence is electroless nickel first and gold second; the brass itself should never be the surface the gold sees, or adhesion and colour both suffer. Thin-walled or sharply recessed parts need a nickel layer thick enough to stay continuous into the recess, so check nickel coverage before the decorative run rather than after it.

How should gold-finished boards be stored and handled through assembly?

The gold layer is there to protect the electroless nickel plating underneath from oxidation, and it keeps doing that through normal storage and handling. Keep boards in their sealed packaging until assembly, avoid bare-hand contact on the pads, wash and dry them if they have been exposed to a humid shop floor, and run your usual bake and reflow profile. The finish is flat and oxidation-resistant, so solder wets quickly and wire bonding sees a clean surface with low contact resistance. If a batch has sat in a damp area for a long time, solder a sample before committing the whole lot.

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