• Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001

Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001

  • High Light

    Steel Substrate Acid Copper Plating Solution

    , 

    Bright Acid Copper Plating Solution

    , 

    Steel Substrate Bright Copper Plating

  • Type
    Brightener
  • Characteristic
    Acid Copper Plating
  • Feature
    Direct Copper Plating
  • Substrate
    Steel And Stainless Steel
  • Place of Origin
    CHINA
  • Brand Name
    FENGFAN
  • Model Number
    FI-ZL001
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    Standard export packaging
  • Delivery Time
    15-25 work days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    200000pcs/day
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001
  • Fengfan Direct Acid Copper Plating Process Steel Substrate acid copper plating solution Bright Copper Plating FI-ZL001

Description

Direct Acid Copper Plating Process ; Direct acid copper plating on steel substrate ; Bright copper plating

 

FI-ZL001

Direct Acid Copper Plating Process

 

Features

• It is cyanide free acid copper plating on steel and iron substrate, especially suitable for continuous plating.

 

• It can be the base layer, instead of semi-bright nickel or watt nickel or cyanide alkali copper plating.

 

• The copper plating layer thickness could be reached more than 200μm.

 

• It does not contain cyanide, so it is easy to treat the wastewater and has little pollution to the environment.

 

• The maintenance of the bath is simple and the service life is long.

 

• High speed copper plating, high current efficiency, and good deep plating ability, especially suitable for reel to reel large current high-speed copper plating.

 

Operation conditions

Operation conditions Range (rack plating) Bath make-up
Copper sulphate(CuSO4·6H2O) 100~150g/L 100g/L
Sulfuric acid(H2SO4) 100~150g/L 70g/L
A 5~25ml/L 25ml/L
B 50~100ml/L 50ml/L
C 50 ~100ml/L 50ml/L
Temp 20~40℃ 30℃
Cathode current density 1~10A/dm2 3A/dm2
Filter Continuous filtration
Stir Cathode rocking or air stirring
Anode Phosphor copper

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